DUONG, Ngoc Binh. Contact Angle of Sn-8Zn-3Bi Lead-free Solder Alloy on Copper Substrate. Old Journal, [S. l.], n. 146B, p. 49–53, 2020. Disponível em: https://jst.vn/index.php/old/article/view/484. Acesso em: 2 aug. 2025.