Contact Angle of Sn-8Zn-3Bi Lead-free Solder Alloy on Copper Substrate
Main Article Content
Abstract
The wettability of Sn-8Zn-3Bi lead free solder alloy on the copper substrate was evaluated via measuring the contact angle of the solder and the substrate. [cite: 2] The measured contact angle was then compared to the contact angle of the traditional and widely used eutectic Sn-37Pb solder alloy. [cite: 3] Experiments to study the effect of temperature, flux, and surface roughness of the substrate on the contact angle were also carried out. [cite: 4] The results show that the contact angle of Sn-8Zn-3Bi on copper substrate decreased as temperature increases. [cite: 5] The minimum value of the contact angle obtained was approximately $23^{\circ}$ for Sn-8Zn-3Bi. [cite: 6] At the same experimental conditions, contact angle of Sn-8Zn-3Bi is higher than that of Sn-37Pb. [cite: 7] When three types of fluxes were used, at $230^{\circ}C,$ contact angle of Sn-8Zn-3Bi has the smallest value with the MHS37 flux, $25^{\circ}$, and it has the largest value with the zinc chloride flux, $47^{\circ}$. [cite: 8] The surface roughness of the substrate has little influence on contact angle of Sn-8Zn-3Bi on copperand the contact angle has changed a few degrees as the roughness changed. [cite: 9]
Keywords
wettability, contact angle, solder alloy
Article Details
References
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