Thermal and Mechanical Properties of Sn-8Zn-3Bi Solder Alloy
Main Article Content
Abstract
Thermal and mechanical properties of Sn-8Zn-3Bi solder alloy on copper substrate was evaluated via measuring the melting temperature, the coefficient of thermal expansion (CTE), the tensile and shear strength of the solder joint. The measured properties of the alloy then compared to the properties of the traditional and widely used eutectic Sn-37Pb solder alloy. The results show that the melting (liquidus) temperature of Sn-8Zn-3Bi was 195 °C, the CTE of Sn-8Zn-3Bi was 22.2 × 10⁻⁶ K⁻¹ in the temperature range of 30–130 °C. At the same testing condition, both tensile and shear strength of Sn-8Zn-3Bi joints were higher than those of Sn-37Pb. Stress-strain curve indicated that the Sn-8Zn-3Bi joints was brittle whilst the Sn-37Pb joints was ductile.
Keywords
solder alloy, thermal properties, mechanical properties
Article Details
References
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between Sn-Ag-Cu an Sn-Zn-Bi solders and Cu
substrate, Science and Technology of Advanced
Materials, Vol. 5, No. 1-2, pp. 267-276, 2004.
https://doi.org/10.1016/j.stam.2003.10.024
environmental benefits of adopting lead-free solders,
The Journal of the Minerals, Metals & Materials
Society, Vol. 59, pp. 12-17, 2007.
https://doi.org/10.1007/s11837-007-0082-8
[2] K.N. Tu and K. Zeng, Tin-lead (SnPb) solder reaction
in flip chip technology, Materials Science and
Engineering Reports R, Vol. 34, pp. 1-58, 2001.
https://doi.org/10.1016/S0927-796X(01)00029-8
[3] Howard H. Manko, Solders and Soldering, 4th edition,
New York, USA: McGRAW-HILL, 2001.
[4] Abtew Mulugeta, Selvaduray Guna, Lead-free solders
in microelectronic, Materials Science and Engineering
Reports, Vol. 27, pp. 95-141, 2000.
https://doi.org/10.1016/S0927-796X(00)00010-3
[5] Seung Wook Yoon, Won Kyoung Choi, Hyuck Mo Lee,
Calculation of surface tension and wetting properties of
sn-based solder alloys, Scripta Materialia, Vol. 40, No.
3, pp. 297-302, 1999.
https://doi.org/10.1016/S1359-6462(98)00417-5
[6] Mario F. Arenas, Viola L. Acoff, Contact Angle
Measurements of Sn-Ag and Sn-Cu Lead-Free Solders
on Copper Substrates, Journal of Electronic Materials
Vol. 33, No. 12, pp. 1452-1458, 2004.
https://doi.org/10.1007/s11664-004-0086-x
[7] E.A. Howell, C.M. Megaridis, M. McNallan, Dynamic
surface tension measurements of molten Sn/Pb solder
using oscillating slender elliptical jets, International
Journal of Heat and Fluid Flow, Vol. 25, pp. 91-102,
2004.
https://doi.org/10.1016/j.ijheatfluidflow.2003.10.003
[8] Mario F. Arenas, Min He, Viola L. Acoff, Effect of flux
on the wetting characteristics of SnAg, SnCu, SnAgBi,
and SnAgCu lead-free solders on copper substrates,
Journal of Electronic Materials, Vol. 35, No. 7, pp.
1530-1536, 2006.
https://doi.org/10.1007/s11664-006-0144-7
[9] Jae-Ean Lee, Keun-Soo Kim, Masahiro Inoue, Junxiang
Jiang, Katsuaki Suganuma, Effects of Ag and Cu
addition on microstructural properties and oxidation
resistance of Sn-Zn eutectic alloy, Journal of Alloys and
Compounds, Vol. 454, pp. 310-320, 2008.
https://doi.org/10.1016/j.jallcom.2006.12.037
[10] H. Y. Guo, J. D. Guo, and J. K. Shang, Influence of
thermal cycling on the thermal resistance of solder
interfaces, Journal of Electronic Materials, Vol. 38, pp.
2470-2478, 2009.
https://doi.org/10.1007/s11664-009-0857-5
[11] H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer,
M. Fine, Creep, stress relaxation and plastic
deformation in Sn-Ag and Sn-Zn eutectic solders,
Journal of Electronic Materials, Vol. 26, pp. 783-790,
1997.
https://doi.org/10.1007/s11664-997-0252-z
[12] Song J.M., Lan G.F., Lui T.S., Chen L.H.,
Microstructure and tensile properties of Sn-9Zn-xAg
lead-free solder alloys, Scripta Materialia, Vol. 48, pp.
1047-1051, 2003.
https://doi.org/10.1016/S1359-6462(02)00647-4
[13] Chang Tao-Chih, Wang Moo-Chin, Hon Min-Hsiung,
Morphology and adhesion strength of the Sn-9Zn3.5Ag/Cu interface after aging, Journal of Crystal
Growth, Vol. 263, pp. 223-231, 2003.
https://doi.org/10.1016/j.jcrysgro.2003.05.002
[14] Shohji Ikuo, Gagg Colin, Plumbridge William J., Creep
properties of Sn-8Zn-3Bi lead-free alloy, Journal of
Electronic Materials, Vol. 33, No. 8, pp. 923-927, 2004.
https://doi.org/10.1007/s11664-004-0222-7
[15] Chiu M.Y., Wang S.S., Chuang T.H., Intermetallic
compounds formed during interfacial reactions between
liquid Sn-8Zn-3Bi solders and Ni substrates, Journal of
Electronic Materials, Vol. 31, No. 5, pp. 494-499, 2002.
https://doi.org/10.1007/s11664-002-0105-8
[16] Shohji Ikuo, Gagg Colin, Plumbridge William J., Creep
properties of Sn-8Zn-3Bi lead-free alloy, Journal of
Electronic Materials, Vol. 33, No. 8, pp. 923-927, 2004.
https://doi.org/10.1007/s11664-004-0222-7
[17] Duong Ngoc Binh, Contact angle of Sn-8Zn-3Bi lead-free solder alloy on copper substrate, Journal of Science
and Technology. Vol. 146, pp. 49-53, 2020.
https://doi.org/10.51316/30.7.9
[18] Fleszar M.F., Lead-tin solder characterization by
differential scanning calorimetry, Thermochimica Acta,
Vol. 367-368, pp. 273-277, 2001.
https://doi.org/10.1016/S0040-6031(00)00671-7
[19] Kim K.S., Huh S.H., Suganuma K., Effects of cooling
speed on microstructure and tensile properties of SnAg-Cu alloys, Materials Science and Engineering: A,
Vol. 333, pp. 106-114, 2002.
https://doi.org/10.1016/S0921-5093(01)01828-7
[20] Shohji Ikuo, Yoshida Tomohiro, Takahashi Takehiko,
Hioki Susumu, Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity, Materials Science
and Engineering A, Vol. 366, pp. 50-55, 2003.
https://doi.org/10.1016/j.msea.2003.09.057
[21] Akio Hirose, Hiroto Yanagawa, Eiichi Ide & Kojiro F.
Kobayashi, Joint strength and interfacial microstructure
between Sn-Ag-Cu an Sn-Zn-Bi solders and Cu
substrate, Science and Technology of Advanced
Materials, Vol. 5, No. 1-2, pp. 267-276, 2004.
https://doi.org/10.1016/j.stam.2003.10.024